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Semiconductor

Wet cleaning solutions with the Optimal range of Ultrasonic Cleaning Systems

In-process and Final cleaning

Unquestionable results with the removal of all unwanted contaminants and particles for a right first time clean

UCS300-SC

The fully automated ultrasonic cleaning system removes any contaminants and particles that have been deposited on the wafer surface, this is achieved through a precise combination of multiple chemical cleaning stages, ultrasonics and agitation, de-ionised water rinsing, incorporating our unique servo-driven slow lift-out mechanism, and a comprehensive drying system. The high performance UCS300-SC provides unmatched cleaning capabilities to ensure maximum productivity and a contamination free surface every time.

*image for illustration purposes only

UCS200-R

The UCS200-R Ultrasonic Cleaning unit gives an exceptional performance for all wafer and cassette requirements. The UCS200-R smoothly transfers the wafers between stages by utilising a 2-Axis robot handling system. The UCS200-R has a multi-stage process memory with quick access, and reset function. The system comprises of comprehensive cleaning, rinsing and drying stages for a right first time clean. In addition, with Class 100 HEPA filtration and extraction as standard, the UCS200-R gives excellent cleaning and drying results with minimal user intervention.

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